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SUMMARY:Design of Multi Service Provisioning Platform on Chip - Dr Asif Iq
 bal
DTSTART:20080324T090000Z
DTEND:20080324T100000Z
UID:TALK11251@talks.cam.ac.uk
CONTACT:Peter Robinson
DESCRIPTION:The Multi Service Provisioning Platform (MSPP) allows telecomm
 unication equipment manufacturers to consolidate multiple services into on
 e box reducing by fourfold the equipment cost\, space and power because of
  silicon integration.  This is accomplished by migrating from multiple dis
 crete devices\, Field Programmable Gate Array (FPGA) and proprietary Appli
 cation Specific Integrated Circuit (ASIC) devices into a single System on 
 Chip (SoC) as described in this presentation.  The SoC is a multi-rate\, m
 ulti-channel\, Add/Drop Muliplexer (ADM) encompassing Synchronous Optical 
 Network (SONET) and Synchronous Digital Hierarchy (SDH) protocols.  The So
 C is the heart of the MSPP system representing central switching fabric an
 d simplifying the function and reducing the cost of the service cards.  \n
 \nThe presentation discusses the development of a highly integrated SoC co
 nsisting of 16 million logic gates and 17 Mbit of SRAM memory employing 0.
 13um Complementary Metal Oxide Semiconductor (CMOS) process technology wit
 h a die area of 19.3x19.3 mm2.  The SoC  was housed in a 1517 pin Flip Chi
 p Ball Grid Array (FCBGA) package.  The SoC affords a unique MSPP solution
  managing an incoming bandwidth of 155 Mbps to 10 Gbps and employing SONET
 /SDH framing\, low/high order path processing\, grooming\, cross-connectio
 n up to 22.5 Gbps and an embedded processor.  \n
LOCATION:Churchill College Møller Centre
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