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SUMMARY:Delamination of thin sheets from sticky substrates - Dominic Vella
  (DAMTP)
DTSTART:20081103T130500Z
DTEND:20081103T140000Z
UID:TALK14779@talks.cam.ac.uk
CONTACT:Dr Ed Brambley
DESCRIPTION:Thin sheets are adhered to substrates in a range of practical 
  applications.  Traditionally the delamination of these sheets is viewed a
 s something to be avoided but in some microscopic applications it can actu
 ally prove useful.  We consider two macroscopic examples of the delaminati
 on of thin sheets from sticky  substrates.  In the first example\, motivat
 ed by 'stretchable electronics'\, delamination is induced by the compressi
 on of a soft substrate and gives rise to a series of blisters with a chara
 cteristic size.  We study this characteristic size and consider the possib
 le implications for stretchable electronics techniques.  In the second exa
 mple\, we take a new look at a classical adhesion test - the 'Blister test
 '.  Using a thin liquid layer as an adhesive we find new delamination patt
 erns that we characterize theoretically. 
LOCATION:MR5\, CMS
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