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SUMMARY:Delamination of thin sheets from sticky substrates - Dominic Vella
 \, ITG
DTSTART:20090205T113000Z
DTEND:20090205T123000Z
UID:TALK16761@talks.cam.ac.uk
CONTACT:Catherine Pearson
DESCRIPTION:Thin sheets are adhered to substrates in a range of practical 
 applications. Traditionally the delamination of these sheets is viewed as 
 something to be avoided but in some microscopic applications it can actual
 ly prove useful. We consider two macroscopic examples of the delamination 
 of thin sheets from sticky substrates. In the first example\, motivated by
  ‘stretchable electronics’\, delamination is induced by the compressio
 n of a soft substrate and gives rise to a series of blisters with a charac
 teristic size. We study this characteristic size and consider the possible
  implications for stretchable electronics techniques. In the second exampl
 e\, we take a new look at a classical adhesion test – the ‘Blister tes
 t’. Using a thin liquid layer as an adhesive we find new delamination pa
 tterns that we characterize theoretically.
LOCATION:Open Plan Area\, BP Institute\, Madingley Rise CB3 0EZ
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