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SUMMARY:Some applications and mechanics for the cracking of stiff films su
 pported on compliant substrates - Professor Michael Thouless\, University 
 of Michigan at Ann Arbor
DTSTART:20110513T133000Z
DTEND:20110513T143000Z
UID:TALK30042@talks.cam.ac.uk
CONTACT:Ms Helen Gardner
DESCRIPTION:A series of parallel cracks can propagate across a stiff film 
 supported on a compliant substrate when it is subjected to a tensile strai
 n.  When films are formed by oxygen plasma or by deposition of metals on a
 n elastomeric substrate such as PDMS\, the crack patterns can form the bas
 is of devices such as adjustable channels that can be used for biological 
 or nano-technological applications.  In addition\, the fracture patterns e
 xhibit some features that have not been previously addressed in analyses o
 f thin-film cracking.  In particular\, the cracks channel through both the
  film and the substrate\, with the depth of the cracks being up to two ord
 ers of magnitude larger than the thickness of the film. A  general mechani
 cs analysis for this problem examines how the properties of the film and c
 ompliant substrate control these crack patterns.
LOCATION: Cambridge University Engineering Department\, LR6
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