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SUMMARY:Some applications and mechanics for the cracking of stiff films su
 pported on compliant substrates - Professor Michael Thouless (University o
 f Michigan)
DTSTART:20110513T133000Z
DTEND:20110513T143000Z
UID:TALK30265@talks.cam.ac.uk
CONTACT:Rebecca Loving
DESCRIPTION:A series of parallel cracks can propagate across a stiff film 
 supported on a compliant substrate when it is subjected to a tensile strai
 n.  When films are formed by oxygen plasma or by deposition of metals on a
 n elastomeric substrate such as PDMS\, the crack patterns can form the bas
 is of devices such as adjustable channels that can be used for biological 
 or nano-technological applications.  In addition\, the fracture patterns e
 xhibit some features that have not been previously addressed in analyses o
 f thin-film cracking.  In particular\, the cracks channel through both the
  film and the  substrate\, with the depth of the cracks being up to two or
 ders of  magnitude larger than the thickness of the film. A  general mecha
 nics analysis for this problem examines how the properties of the film and
   compliant substrate control these crack patterns.
LOCATION:Department of Engineering - LR6
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