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SUMMARY:Mechanics of Stretchable Electronics - Professor Yonggang Huang\, 
 Joseph Cummings Professor of Civil and Environmental Engineering and Mecha
 nical Engineering\, Department of Mechanical Engineering\, Northwestern Un
 iversity
DTSTART:20140410T133000Z
DTEND:20140410T150000Z
UID:TALK50938@talks.cam.ac.uk
CONTACT:Ms Helen Gardner
DESCRIPTION:Recent advances in mechanics and materials provide routes to i
 ntegrated circuits that can offer the electrical properties of conventiona
 l\, rigid wafer-based technologies but with the ability to be stretched\, 
 compressed\, twisted\, bent and deformed into arbitrary shapes.  Inorganic
  electronic materials in micro/nanostructured forms\, intimately integrate
 d with elastomeric substrates offer particularly attractive characteristic
 s in such systems\, with realistic pathways to sophisticated embodiments. 
  Mechanics plays a key role in this development by identifying the underly
 ing mechanism and providing analytical solutions to guide design and fabri
 cation.  I will present our research on the enabling technology (transfer 
 printing [1]) and materials (stretchable silicon\, [2\,3]\, interconnect [
 4])\, and their applications to stretchable and foldable circuits [5]\, el
 ectronic-eye camera [6\,7]\, solar cell [8]\, semi-transparent and flexibl
 e LED [9] and its application to medicine [10]\, neural [11] and cardiac s
 ensors [12]\, cardiac ablation therapy [13]\, epidermal electronics [14] w
 ith applications to human skin [15]\, flexible electrode array for mapping
  brain activity in vivo [16\,17]\, dissolvable electronics [18]\, carbon n
 anotubes [19]\, battery [20]\, pressure sensor [21]\, antenna [22]\, and i
 njectable\, cellular-scale optoelectronics [23].  Review of stretchable el
 ectronics has been published [24].\n	\n1. Meitl et al.\, Nature Materials 
 5\, p 33\, 2006 (cover article).\n2. Khang et al.\, Science 311\, p 208\, 
 2006.\n3. Sun et al.\, Nature Nanotechnology 1\, p 201\, 2006.\n4. Park et
  al.\, Nature Communications 3:916 doi: 10.1038/ ncomms1929\, 2012.\n5. Ki
 m et al.\, Science 320\, p 507\, 2008 (inner cover article).\n6. Ko et al.
 \, Nature 454\, p 748\, 2008 (cover article).\n7. Song et al.\, Nature 497
 \, 95-99\, 2013 (cover article).\n8. Yoon et al.\, Nature Materials 7\, p 
 907\, 2008 (cover article).\n9. Park et al.\, Science 325\, p 977\, 2009.\
 n10. Kim et al.\, Nature Materials 9\, p 929\, 2010.\n11. Kim et al.\, Nat
 ure Materials 9\, p 511\, 2010 (cover article).\n12. Viventi et al.\, Scie
 nce Translational Medicine 2\, 24ra22\, 2010 (cover article).\n13. Kim et 
 al.\, Nature Materials 10\, 316-323\, 2011.\n14. Kim et al.\, Science 333\
 , p 838\, 2011.\n15. Webb et al.\, Nature Materials 12\, p 938\, 2013.\n16
 . Viventi et al.\, Nature Neuroscience 14\, p 1599\, 2011.\n17. Xu et al.\
 , Nature Communications (in press)\, 2014.\n18. Hwang et al.\, Science 337
 \, 1640-1644\, 2012 (cover article).\n19. Jin et al.\, Nature Nanotechnolo
 gy 8\, 347-355\, 2013.\n20. Xu et al.\, Nature Communications 4:1543 doi: 
 10.1038/ncomms2553\, 2013.\n21. Persano et al.\, Nature Communications 4:1
 633 doi: 10.1038/ncomms2639\, 2013.\n22. Fan et al.\, Nature Communication
 s (in press)\, 2014.\n23. Kim et al.\, Science 340\, 211-216\, 2013.\n24. 
 Rogers et al.\, Science 327\, p 1603\, 2010.
LOCATION:Department of Engineering - LR4
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