Abstract

The Multi Service Provisioning Platform (MSPP) allows telecommunication equipment manufacturers to consolidate multiple services into one box reducing by fourfold the equipment cost, space and power because of silicon integration. This is accomplished by migrating from multiple discrete devices, Field Programmable Gate Array (FPGA) and proprietary Application Specific Integrated Circuit (ASIC) devices into a single System on Chip (SoC) as described in this presentation. The SoC is a multi-rate, multi-channel, Add/Drop Muliplexer (ADM) encompassing Synchronous Optical Network (SONET) and Synchronous Digital Hierarchy (SDH) protocols. The SoC is the heart of the MSPP system representing central switching fabric and simplifying the function and reducing the cost of the service cards.

The presentation discusses the development of a highly integrated SoC consisting of 16 million logic gates and 17 Mbit of SRAM memory employing 0.13um Complementary Metal Oxide Semiconductor (CMOS) process technology with a die area of 19.3×19.3 mm2. The SoC was housed in a 1517 pin Flip Chip Ball Grid Array (FCBGA) package. The SoC affords a unique MSPP solution managing an incoming bandwidth of 155 Mbps to 10 Gbps and employing SONET /SDH framing, low/high order path processing, grooming, cross-connection up to 22.5 Gbps and an embedded processor.